pcb manufacturing PDF

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What is PCB manufacturing?

PCB Manufacturing: PCB manufacturing is the construction of your board design. This is a two-step process that begins with board fabrication and ends with printed circuit board assembly (PCBA).

How are PCB boards manufactured?

The manufacture of the PCBs is normally achieved using a chemical etching process. … Typically the copper on the bare printed circuit boards is covered with a thin layer of photo-resist. It is then exposed to light through a photographic film or photo-mask detailing the tracks required.

How much does a PCB factory cost?

In general, the cost to produce a PCB will cost between $10 and $50 per board. The actual price will be determined by the manufacturer and could be higher or lower based on the components, size, and type of material used.

What is a multilayer PCB?
Introduction to multilayer PCB´s
• The green thing with holes in it.
• The first item needed when building any electronic product, but
often ordered last.
• A platform for components.
• Circuitry with pre-defined electrical function.
• Three or more conductive layers of copper which have been
bonded to non-conductive substrates, yet are electrically connected
where needed, so that they connect specific components using
features (tracks and component pads) that have been imaged and
etched to form a bespoke design, in order to fulfill a bespoke
function.

Electroless and Panel plating
MANUFACTURING PROCESS
Using the two processes the aim is to provide a uniform deposit of
copper onto the hole wall through both chemical and electrochemical
reactions.
Electroless copper is there only to provide a very thin deposit of ≤ 1um
that covers the hole wall and also the complete panel.
A complex chemical process that utilises a log of chemistry and with this
being the base deposit, if this is poorly controlled then reliability is
compromised.
Panel plating follows on from electroless to provide a thicker deposit of
copper on top of the electroless deposit – typically 5 to 8 um.
The combination is used to optimise the amount of copper that is to be
plated and etched in order to achieve the track and gap demands.

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